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datashee t product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 tsz22111 ? 14 ? 001 www.rohm.com 3-phase brushless motor driver BD63005MUV general description BD63005MUV is a 3-phase brushless motor driver with a 33v power supply voltage rating and a 2a (3.5a peak) output current rating. it generat es a driving signal from the hall sensor and drives pwm through the input control signal. in addition, the power supply can use 12v or 24v and it has various controls and built-in protection functions, making it useful fo r variety of purposes. since the ic adopts small packages, it can be used on small diameter motors. features ? built-in 120 commutation logic circuit ? low on resistance dmos output ? pwm control mode (low side arm switching) ? built-in power-saving circuit ? cw/ccw function ? short brake function ? fg output (1fg/3fg conversion) ? built-in protection circuit for current limiting (cl), overheating (tsd), over current (ocp), under voltage (uvlo), over voltage (ovlo), motor lock (mlp) applications ? oa machines ? other consumer products key specifications ? power supply voltage rating 33v ? output current rating (continuous): 2.0a ? output current rating (peak): 3.5 (note1) a ? operating temperature range: -25 to +85c ? stand-by current: 1.2ma(max) ? current limit detect voltage: 0.2v10% ? output on resistance (top & bottom total): 0.17? (typ) ? uvlo lockout voltage: 6.0v(typ) (note1) pulse width tw 1ms, duty=20% pulse package w(typ) x d(typ) x h(max) vqfn040v6060 6.00mm x 6.00mm x 1.00mm typical application circuit(s) figure 1. application circuit
datasheet datasheet 2/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV pin configuration block diagram pin description pin no. pin name function pin no. pin name function 1 rcl detect voltage input for over current 21 gnd ground 2 rnf detect resistor for over current 22 cp1 charge pump setting 1 3 rnf detect resistor for over current 23 cp2 charge pump setting 2 4 rnf detect resistor for over current 24 vg charge pump output 5 rnf detect resistor for over current 25 vcc power supply 6 nc nc 26 vcc power supply 7 v v phase output 27 vcc power supply 8 v v phase output 28 vcc power supply 9 nc nc 29 lpe setting about motor lock protection (h/m/l input) 10 pgnd ground 30 brkb brake input (negative logic) 11 w w phase output 31 pwmb pwm input (negative logic) 12 w w phase output 32 cw cw/ccw input (h:cw, l:ccw) 13 nc nc 33 fgo fg output (1fg or 3fg) 14 vreg regulator output (off at stand-by) 34 enb enable input (negative logic) 15 hup u phase hall input 35 fgsw 1fg/3fg switching (h:3fg, l:1fg) 16 hun u phase hall input 36 clnmt current limit mask time setting (h/m/l input) 17 hvp v phase hall input 37 nc nc 18 hvn v phase hall input 38 u u phase output 19 hwp w phase hall input 39 u u phase output 20 hwn w phase hall input 40 nc nc figure 2. pin configuration (top view) enb vreg hup hun hvp hvn hwp hwn logic pwmb cw brkb 9 fgo osc rcl vreg lpe 31 32 30 34 15 16 17 18 19 20 29 14 33 1 pre driver 38 7 11 rnf rnf 2 vcc 26 vcc 25 gnd 21 pgnd 10 5 tsd, ocp uvlo, ovlo vreg fgsw 35 clnmt 36 4 charge pump vg cp1 cp2 23 22 24 28 27 4 3 39 8 12 u v w figure 3. block diagram
datasheet datasheet 3/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV absolute maximum ratings (ta = 25c) item symbol limit unit power supply voltage v cc -0.3 to +33.0 v vg voltage v g -0.3 to +38.0 v control input voltage v in ,v in2 -0.3 to +5.5 v fgo terminal voltage v fgo -0.3 to +7.0 v rnf maximum apply voltage v rnf 0.7 v vreg output current i vreg -30 (note 1) ma fgo output current i fgo 5 (note 1) ma driver output current (continuous) i out(dc) 2.0 (note 1) a/phase driver output current (peak) (note2) i out(peak) 3.5 (note 1) a/phase operating temperature range t opr -25 to +85 c storage temperature range t stg -55 to +150 c power dissipation pd 1.00 (note 3) w 4.66 (note 4) w junction temperature t jmax 150 c (note 1) do not exceed pd, aso, and t j =150c. (note 2) pulse width tw 1ms, duty=20% pulse. (note 3) 74.2mm 74.2mm 1.6mm glass epoxy standard board. reduce by 8.0mw/c over ta=25c. (note 4) 4-layer recommended board. r educe by 37.3mw/c over ta=25c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. ther efore, it is important to consider circui t protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta= -25c to +85c) item symbol min typ max unit supply voltage v cc 10 24 28 v
datasheet datasheet 4/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV description of block(s) 1) commutation logic this ic adopts 120 commutation mode, and the truth table is as follows: hu hv hw cw (cw=h or open) ccw (cw=l) fgo u v w u v w 1fg 3fg h l h pwm* h hi-z h pwm* hi-z l hi-z h l l pwm* hi-z h h hi-z pwm* l l h h l hi-z pwm* h hi-z h pwm* l hi-z l h l h pwm* hi-z pwm* h hi-z hi-z l l h h h hi-z pwm* pwm* hi-z h hi-z hi-z l l h hi-z h pwm* hi-z pwm* h hi-z l * when pwmb=?l? pwm="l" when pwmb=?h? pwm="h". 2) regulator output terminal (vreg) this is constant voltage output terminal of 5v(typ). it is recommended to connect capacitors of 0.01f to 1f. please be careful that vreg current does not exceed rating s in case of being used for bias power supply of hall elements. 3) enable input terminal (enb) output of each phase can be set to on /off (negative logic) through enb terminal. when applied voltage is v ena , the motor is driven (enable). when applied voltage is v stby or open, the motor stops (stand-by). stand-by mode has precedence to other control input signal and vreg output is off. in addition, enb terminal is pulled up by internal power supply through a resistance of 100k ? (typ) 30k ? . enb operation h or open stand-by l enable 4) pwm input terminal (pwmb) speed can be controlled by inputting pwm signal into pwmb terminal (negative logic). synchronous rectifier pwm can be achieved through lower switching. when pwmb=" l", driv er output that belongs to hall input logic is ?l?. when pwmb="h" or open, driver output is "h". when pwmb="h" or open st atus is detected 104s (typ), the synchronous rectifier is off. synchronous rectifier is on through falling edg es of subsequent pwmb. additionally, pwmb terminal is pulled up by vreg through a resistance of 100k ? (typ) 30k ? . pwmb driver output h or open h (hi-z) l l 5) brake input terminal (brkb) motor rotation can be quickly stopped by brkb terminal (negat ive logic). when brkb="l", all driver outputs are "l" (short brake). when brkb="h" or open, then short brake action is released. in addition, brkb terminal is pulled up by vreg through a resistance of 100k ? (typ) 30k ? . brkb operation h or open normal l short brake
datasheet datasheet 5/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV 6) cw/ccw input terminal (cw) rotation direction can be switched with cw terminal. when cw="h" or open, the direction is cw. when cw="l", the direction is ccw. though we do not recommend switching rotation direction when motor is rotating, because if rotation direction is switched when rotating, the rotation speed becomes hall frequency that is up to less than 40hz (typ) and it is switched to the set rotation direction after th e action short brake. in addition, cw terminal is pulled up by vreg through resistance of 100k ? (typ) 30k ? . cw direction h or open cw l ccw 7) 1fg/3fg switching terminal (fgsw) fg signal that is output from fgo te rminal can be switched to 1fg/3fg. it becomes 3fg by fgsw="h" or open, and 1 fg by fgsw="l". moreover, fgsw terminal is pulled up by vreg through resistance of 100k ? (typ)30k ? . fgsw fgo h or open 3fg l 1fg 8) hall input (hall: hup, hun, hvp, hvn, hwp, hwn) hall input amplifier is designed with hysteresis (15mv (typ )) in order to prevent incorrect action due to noise inside. so please set bias current for hall element to make am plitude of hall input voltage over minimum input voltage (v hallmin ). here, we recommend you to connect the ceramic capacitor with about 100pf to 0.01f between difference input terminals of hall amplifier. the in-phase input voltage range designed for hall input amplifier is v hallcm , 0v to vreg-1.7v, so please set within this range when applying bias to hall element. when all hall inputs become "h" or "l", detect circuit detects these hall in put abnormalities and makes all driver outputs "hi-z". 9) fg output terminal (fgo) 1fg or 3fg signal that is reshaped by hall signal is output fr om fgo terminal. it is does not have output in stand-by mode. in addition, because fg terminal is output fr om open drain, please use resistance of about 10k ? to 100k ? pulled up from outside. in that case, please be care ful that fgo voltage or current never exceed rating. 10) power supply terminal (vcc) please make low impedance thick and short since motor drive current flows. please stabilize v cc by placing bypass capacitor near terminal as much as possible because v cc might be changed considerably by motor bemf and pwm switching. please add capacity of capacitor as necessary when using large current and motor with large bemf. moreover, it is recommended to place laminated ceramic capacitor of around 0.01f to 0.1f in parallel on the purpose of decreasing impedance of power s upply broadband. please be careful that v cc never exceeds ratings. vcc terminal has clamp element for preventing esd dam age. if applying steep pulse signal and voltage such as surge more than ratings, this clamp element operates, which might be a cause of destruct ion. it is effective to put zener diode that corresponds to v cc absolute maximum ratings. diode for preventing esd damage is inserted between vcc and gnd terminals. please note that ic mi ght be destroyed when bemf is applied to vcc and gnd terminals. 11) ground terminal (gnd, pgnd) wiring impedance from this terminal should be as low as possible for reducing noise of switching current and stabilizing basic voltage inside of ic, and the impedance also should be the lowest potential in any operating condition. in addition, please do pattern design not to have same impedance as other gnd pattern. 12) driver output terminal (u, v, w) impedance wiring should be thick, short, and low due to motor drive current. when using big current, in case that driver current changes considerably towa rd positive and negative (when bemf is large), malfunction or destruction of ic might occur. it is effective to add shot key diode. moreover , clamp element is built in driver output terminal in order to prevent esd damage. if applying steep pulse signal or voltage such as surge more than ratings, this clamp element operates. then it might cause destruction of ic, so that please pay attention not to exceed ratings. additionally, when driver output converts "l" "h" or "h" "l", for example when synchronous rectification pwm operating , dead time (1s to 2s(typ)) can be set to prevent simultaneous on of output top & bottom mos. 13) capacitor connection terminal for boosti ng, boosting output terminal (cp1, cp2, vg) charge pump is built-in for upper nch mos drive signal of driver output. boosting voltage of v cc +5v (typ) occurs in vg terminal by connecting capacitor between cp1 to cp2 terminals and vg to vcc terminals. it is recommended to use capacitor more than 0.1f.
datasheet datasheet 6/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV 14) resistor connection terminal for detecting output current (rnf) please insert resistor for detecting current 0.05 ? to 0.5 ? between rnf and gnd. when deciding resistor value, it should be careful that consumption electric ity of resistor for detecting current i out 2 ? r[w] does not exceed rating of resistor. in addition, please do not have same impedance as other gnd patterns by using low impedance wiring, since motor drive current flows into pattern of rnf terminal to resistor for detecting current to gnd. in case that rnf voltage goes over rating (0.7v), circuit malfunction might occur. therefore please do not exceed rating. when rnf terminal is shorted to gnd, big current flows due to a lack of normal current limit operati on. please be careful that ocp or tsd might operate in that case. similarly, if rnf terminal is open, out put current might not flow, which also becomes a cause of malfunction. 15) comparator input terminal fo r detecting output current (rcl) rcl terminal is placed individually as input terminal of cu rrent detect comparator in order to avoid deterioration of current detect accuracy by wire impedance inside ic of rnf terminal. therefore, when operating current limit, please be sure to connect rnf terminal and rcl terminal. moreover, it is possible to reduce dete rioration of current detect accuracy by impedance of board pattern between rnf terminal and resistor for detecting current by connecting wiring from rcl terminal most adjacent to resistor for det ecting current. please design pattern considering wiring that is less influenced by noise. additionally, when rcl terminal is shorted to gnd, big current might flow due to a lack of normal current limit operation. please be careful t hat ocp or tsd might operate in that case. 16) non-connection terminal (nc) it is not connected to internal circuit electrically. 17) control signal sequence though we recommend you input control signals of enb, pwmb, brkb, fgsw, cw, clnmt, lpe terminals after inputting v cc , there is no problem if you input control signals before inputting v cc . if lpe terminal is set to "h" or "m" when being started, please be informed that if motor rota tion cannot be detected within the set time (edge of fgo signal cannot be input), then the mlp circuit starts and motor fa ils to start. moreover, the order of priority is set to control signal and ic internal signal. please refer to the following table. priority of control signal priority input / internal signals 1 st enb, uvlo 2 nd brkb?? ,cw ?? ,pwmb 3 rd tsd, ocp, mlp, hallerr 4 th ovlo 5 th brkb 6 th cl 7 th pwmb, cw note ?? means rising and falling edges of signal. for signal name, please see state transition diagram.
datasheet datasheet 7/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV protection circuit 1) current limit circuit (cl circuit) current limit of output (current limit: cl) can be achi eved by changing voltage of output current with resistor between rnf and gnd, and then inputting the voltage into rcl terminal. in order to avoid error detection of current detection comparator by rnf spike noi se that occurs at output on, using mask time can be efficient. current detection is invalid during mask time after rcl voltage be comes more than 0.2v (typ). then please turn off all lower mos of driver output, which is returned automatically after specified time (32s (typ)). this operation is not synchronized with pwm signal that is input into pwmb terminal. moreover, it is poss ible to change mask time by clnmt terminal. at clnmt="h" or open, 0.5s (typ). at clnmt="m", 0.75s (typ). at clnmt="l", 0.25s (typ). clnmt terminal is also pulled up by vreg through a resistance of 100k ? (typ) 30k ? . clnmt mask time h or open 0.5s (typ) 0.3s m 0.75s (typ) 0.4s l 0.25s (typ) 0.2s 2) thermal shut down circuit (tsd circuit) when chip temperature of driver ic rises and exceeds t he set temperature (175c (typ)), the thermal shut down circuit (thermal shut down: tsd) begins to work. at this time, the driver outputs all become "hi-z". in addition, the tsd circuit is designed with hysteresis (25c (typ)), therefore, when the chip te mperature drops, it returns to normal working condition. moreover, the purpose of the tsd circuit is to protect driver ic from thermal breakdown, therefore, temperature of this circuit will be over working temperature when it is started up. thus, thermal design should have sufficient margin, so do not take continuous use and action of the circuit as a precondition. 3) over current protection circuit (ocp circuit) over current protection (over current protection ocp) is built-in in order to prevent from destruction when being shorted between output terminals and also being vcc/gnd shorted. therefore output current exceeds ratings and specified current flows. in that case , driver outputs are all latched to hi-z c ondition. latch can be released by going through stand-by condition or switching brkb/cw logic. ho wever, output current rating is exceeded when this circuit operates. thus, please design sufficient margin not to take continuous use and action of the circuit as a precondition. 4) under voltage lock out circuit (uvlo circuit) there is a built-in under voltage lock out circuit (under voltage lock out: uvlo) used to ensure the lowest power supply voltage for drive ic to work and to prevent error action of ic. when v cc declines to v uvl (6v (typ)), all of the driver outputs should be "hi-z". at the same time, uvlo circuit is designed with hysteresis (1v (typ)), so when v cc reaches more than v uvh (7v (typ)), it enters normal working condition. 5) over voltage lock out circuit (ovlo circuit) there is built-in over voltage lock out circuit (over voltage lock out: ovlo) used to restrain rise of v cc when motor is decelerating. when lpe terminal is at "m" and v cc is over v ovh1 (16v (typ)), and when lpe terminal is at "h" or "l" and v cc is over v ovh2 (31v (typ)), a certain time (4ms (typ)) of short brake action is c onducted. what?s more, because ovlo circuit is designed with hysteresis, therefore, when v ovh1 is below v ovl1 (15v (typ)) and when v ovh2 is below v ovl2 (30.5v (typ)), it can return to normal working c ondition after a certain time of short brake action. 6) motor lock protection circuit (mlp circuit) there is built-in motor lock protection circuit (motor lo ck protection: mlp). the on/off of mlp circuit and ovlo threshold can be set from lpe terminal. in monitoring hall signals, when the lpe = "h" or "m" and hall signal logic does not change to 1.1sec(typ), all driv er outputs are locked as "hi-z". latch can be released via standby status or through switching brkb/cw logic. moreover, when pwmb = "h" or open state is det ected for about 15ms, latch can be released by rising and falling edges of subsequent pwmb. however, when lpe = "l", mlp circuit does not work when short brake action (including switching rotation direction) enables or tsd circuit works. in addition, lpe terminal is pulled up by vreg through a resistance of 100k ? (typ) 30 k ? . lpe monitoring time ovlo threshold h or open 1.1sec(typ) 30% v ovh2 , v ovl2 m 1.1sec(typ) 30% v ovh1 , v ovl1 l disable v ovh2 , v ovl2
datasheet datasheet 8/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV electrical characteristics (unless otherwise specified ta=25c,v cc =24v) item symbol limit unit condition min typ max [whole] circuit current i cc - 3.9 7.8 ma v enb =0v stand-by current i stby - 0.6 1.2 ma enb=open vreg voltage v reg 4.5 5.0 5.5 v i vreg =-10ma [driver output] output on resistance r on - 0.17 0.27 ? i out =1.5a(upper + lower) [hall input] input bias current i hall -2.0 -0.1 +2.0 a v hall =0v range of in-phase input voltage v hallcm 0 - v reg -1.7 v minimum input voltage v hallmin 50 - - mv p-p hys level v hallhy+ 5 15 25 mv hys level v hallhy- -25 -15 -5 mv [input of control enb] input current i enb -75 -45 -25 a v enb =0v standby voltage v stby 2.0 - v reg v enable voltage v ena 0 - 0.8 v [input of control pwmb, cw, brkb, fgsw] input current i in -80 -50 -30 a v in =0v voltage input h v inh 2.0 - v reg v voltage input l v inl 0 - 0.8 v minimum input pulse width t plsmin 1 - - msec cw, brkb [input of control lpe, clnmt] input current i in2 -80 -50 -30 a v in2 =0v input voltage "h" v inh2 0.8 v reg - v reg v input voltage "m" v inm2 0.4 v reg - 0.6 v reg v input voltage "l" v inl2 0 - 0.2 v reg v [fg output fgo] output voltage l v fgol 0 0.1 0.3 v i fgo =2ma [current limit] detect voltage v cl 0.18 0.20 0.22 v [uvlo] release voltage v uvh 6.5 7.0 7.5 v lockout voltage v uvl 5.5 6.0 6.5 v [ovlo] release voltage1 v ovl1 14.0 15.0 16.0 v lpe="m" lockout voltage1 v ovh1 15.0 16.0 17.0 v lpe="m" release voltage2 v ovl2 29.0 30.5 32.0 v lpe="h" or "l" lockout voltage2 v ovh2 29.5 31.0 32.5 v lpe="h" or "l"
datasheet datasheet 9/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV timing chart figure 4. timing chart pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm hu hv hw fgo(3fg) cw direction (cw="h" or open) ccw direction (cw="l") fg output hu hv hw u v w u v w fgo(1fg)
datasheet datasheet 10/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV state transition diagram figure 5. state transition diagram legend: dir: motor rotational direction lp: motor lock protection lpc: internal counter for the motor lock protection (watch-dog timer) state transition f hall : hall signal frequency command signal hall error: hu=hv=hw &: logical "and" +: logical "or" note) all values are typical detect hall edge & lpe="h" or "m" within 1.1sec. run short brake (lpc=reset) brk brk ____ dir change cw f hall >40hz f hall <40hz f hall <40hz & brk ____ brkb dir lp timer (lpc=run, lpe="h" or "m" only) lpe lpc reset hall edge undetected & lpe="h" or "m" both side drivers off (lpc=reset) both side drivers off low side driver off tsd ____ tsd after 32 s over current hall error + vg_uvlo both side drivers off with latch lpc overflow dir change + brk + pwmb fall edge after pwmb="h" over 15ms. stand-by (lpc=reset, driver off) enb="h" ? vreg off enb ____ _____ enb & uvlo enb + uvlo ovlo short brake after 4ms hall error ________ vg_uvlo _________ & enb + uvlo
datasheet datasheet 11/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV i/o equivalence circuits fgsw pwmb brkb cw 100k ? 10k ? vreg enb 100k ? 10k ? internal reg vcc vreg 145k ? 50k ? hup hun hvp hvn hwp hwn vreg 2k ? rcl 250k ? 2k ? vreg vcc u v w rnf fgo 5 ? clnmt lpe 100k ? 10k ? vreg 10k ? internal reg cp1 20 ? cp2 20 ? vg vcc power dissipation vqfn040v6060 package has metal for heat dissipation on backside of ic. it is supposed to use this metal for processing heat dissipation, so please connect to gnd plane on board by soldering and keep gnd pattern as large as possible to get enough heat dissipation area. it is impossible to keep power dissipation as shown below without soldering. the backside metal is shorted to backside of ic chip and it is also gnd potential. therefore pl ease do not make wiring pattern other than gnd right under backside metal of ic, sinc e malfunction and destruction of ic might occur by being shorted to potential other than gnd. package thermal resistor board j-a [c/w] board 125 board 33.2 board 26.8 pcb size 74.2mm 74.2mm 1.6mm board ? 1 layer pcb (1 layer 23.69mm 2 ) board ? 4 layer pcb (1,4 layer 23.69mm 2 . 2,3 layer 5505mm 2 ) board ? 4 layer pcb (all layers 5505mm 2 ) () copper foil pattern area size caution values about heat reducing curve and packaged thermal resistor are tested values. figure 6. i/o equi valence circuits 0. 0 1. 0 2. 0 3. 0 4. 0 5. 0 0 25 5 0 7 5 1 00 12 5 1 50 amb ie nt temp era ture [ c] pd [w] 4.66w 1.00w 3.77w figure 7. derating curve (vqfn040v6060)
datasheet datasheet 12/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 74.2mm x 74.2mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consider ation to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet datasheet 13/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV operational notes ? continued 11. unused input terminals input pins of an ic are of ten connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused in put pins should be connected to the power supply or ground line. 12. regarding the input pins of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 9. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power di ssipation are all within the area of safe operation (aso). 15. thermal shutdown circuit (tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic has a built-in overcurrent protection circuit that activa tes when the output is accidentally shorted. however, it is strongly advised not to subject the ic to prolonged shorting of the output.
datasheet datasheet 14/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV ordering information b d 6 3 0 0 5 mu v - e 2 part number package muv: vqfn040v6060 packaging and forming specification e2: embossed tape and reel marking diagrams part number marking package orderable part number bd63005 vqfn040v6060 BD63005MUV-e2 vqfn040v6060 (top view) bd63005 part number marking lot number 1pin mark
datasheet datasheet 15/15 tsz02201-0p1p0b000610-1-2 ? 2014 rohm co., ltd. all rights reserved. 14.jan.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD63005MUV physical dimension, tape and reel information package name vqfn040v6060 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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